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A Study on the Thermal Deformation and the Mechanical Properties due to Curing Process of the Encapsulation Resin

[+] Author Affiliations
Hiroyuki Sato, Qiang Yu, Ryusuke Sone

Yokohama National University, Yokohama, Kanagawa, Japan

Paper No. IPACK2011-52101, pp. 185-190; 6 pages
doi:10.1115/IPACK2011-52101
From:
  • ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems
  • ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1
  • Portland, Oregon, USA, July 6–8, 2011
  • ISBN: 978-0-7918-4461-8
  • Copyright © 2011 by ASME

abstract

Since the flexural rigidity of thin semiconductor package becomes much lower than normal components, the warpage of the component becomes a much more important issue to evaluate the reliability. In this study the author propose a new practical method to measure the real time curing deformation and the elastic modulus of the resin during the whole curing process. The thermal deformation of the resin under curing was measured by using the optical digital image correlation method. Next, to examine the mechanical properties of the resin, the liquid resin was poured into an aluminum frame with thin sole, and the bending rigid of the aluminum frame was measured by the three points bending test every minutes at the curing temperature of the resin. Based upon the experimented result, the warpage of a package caused of curing shrinkage was simulated.

Copyright © 2011 by ASME

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