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The Most Cost-Effective Integrator (TSV Interposer) for 3D IC Integration System-in-Package (SiP)

[+] Author Affiliations
John H. Lau

Industrial Technology Research Institute (ITRI), Hsinchu, Taiwan

Paper No. IPACK2011-52189, pp. 53-63; 11 pages
doi:10.1115/IPACK2011-52189
From:
  • ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems
  • ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1
  • Portland, Oregon, USA, July 6–8, 2011
  • ISBN: 978-0-7918-4461-8
  • Copyright © 2011 by ASME

abstract

The significant roles of Cu-filled TSV passive interposers for 3D IC integration are investigated in this study. Emphasis is placed on the roles they play as: (1) substrates; (2) carriers; (3) thermal management tools; and (4) reliability buffers. It is shown that the Cu-filled TSV passive interposers are the most cost-effective integrator for 3D IC integration system-in-package (SiP).

Copyright © 2011 by ASME

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