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Effect of Nanofluid on the Film Boiling Behavior at Vapor Film Collapse

[+] Author Affiliations
Takahiro Arai, Masahiro Furuya

Central Research Institute of Electric Power Industry, Komae, Tokyo, Japan

Paper No. ICONE17-75764, pp. 633-638; 6 pages
  • 17th International Conference on Nuclear Engineering
  • Volume 3: Thermal Hydraulics; Current Advanced Reactors: Plant Design, Construction, Workforce and Public Acceptance
  • Brussels, Belgium, July 12–16, 2009
  • Conference Sponsors: Nuclear Engineering Division
  • ISBN: 978-0-7918-4353-6 | eISBN: 978-0-7918-3852-5
  • Copyright © 2009 by ASME


A high-temperature stainless-steel sphere was immersed into Al2 O3 nanofluid to investigate film boiling heat transfer and collapse of vapor film. Surface temperature is referred to the measured value of thermocouples embedded into and welded onto a surface of the sphere. A direct contact between the immersed sphere and Al2 O3 nanofluids is quantified by the acquired electric conductivity. The Al2 O3 nanofluid concentration is varied from 0.024 to 1.3 vol%. A film boiling heat transfer rate of Al2 O3 nanofluid is almost the same or slightly lower than that of water. A quenching temperature rises slightly with increased the Al2 O3 nanofluid concentrations. In both water and Al2 O3 nanofluid, the direct contact signals between the sphere and coolant were not detected before vapor film collapse.

Copyright © 2009 by ASME



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