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Numerical Simulation of Thermocapillary-Buoyancy Convection in Encapsulated Liquid Column With Deformable Interfaces

[+] Author Affiliations
Lan Peng, Juan-Fang Liu, You-Rong Li, Yan Wang

Chongqing University, Chongqing, China

Paper No. ICNMM2009-82160, pp. 1031-1036; 6 pages
  • ASME 2009 7th International Conference on Nanochannels, Microchannels, and Minichannels
  • ASME 2009 7th International Conference on Nanochannels, Microchannels and Minichannels
  • Pohang, South Korea, June 22–24, 2009
  • Conference Sponsors: Nanotechnology Institute
  • ISBN: 978-0-7918-4349-9 | eISBN: 978-0-7918-3850-1
  • Copyright © 2009 by ASME


The physical and mathematical models of thermocapillary-buoyancy convection in two immiscible liquid layers are established. In order to capture the free surface and the liquid-liquid interface deformation, Runge-Kutta method is adopted to solve the Young-Laplace equation. Numerical simulation of thermocapillary-buoyancy convection in encapsulated liquid bridge is performed by employing primitive valuable method and finite volume method. The fluids of liquid bridge and liquid encapsulation are FC-70 and KF-96, respectively. Furthermore, the profiles of temperature and velocity in encapsulated liquid bridge are obtained. Meanwhile, the effects of a series of non-dimensional parameters on the thermocapillary-buoyancy convection are analyzed.

Copyright © 2009 by ASME



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