0

Full Content is available to subscribers

Subscribe/Learn More  >

Thermal Modeling of Atomic-Scale Three-Dimensional Phononic Crystals for Thermoelectric Applications

[+] Author Affiliations
Jean-Numa Gillet, Yann Chalopin, Sebastian Volz

Ecole Centrale Paris, Châtenay-Malabry, France

Paper No. ENIC2008-53052, pp. 61-70; 10 pages
doi:10.1115/ENIC2008-53052
From:
  • ASME 2008 3rd Energy Nanotechnology International Conference collocated with the Heat Transfer, Fluids Engineering, and Energy Sustainability Conferences
  • ASME 2008 3rd Energy Nanotechnology International Conference
  • Jacksonville, Florida, USA, August 10–14, 2008
  • Conference Sponsors: Nanotechnology Institute
  • ISBN: 0-7918-4323-9 | eISBN: 0-7918-3832-3
  • Copyright © 2008 by ASME

abstract

Extensive research on semiconducting superlattices with a very low thermal conductivity was performed to fabricate thermoelectric materials. However, as nanowires, superlattices affect heat transfer in only one main direction, and often show dislocations owing to lattice mismatches when they are made up of a periodic repetition of two materials with different lattice constants. This reduces their electrical conductivity. Therefore it is challenging to obtain a thermoelectric figure of merit ZT superior to unity with the superlattices. Self-assembly with lithographic patterning and/or liquid precursors is a major epitaxial technology to fabricate ultradense arrays of germaniums quantum dots (QDs) in silicon for many promising electronic and photonic applications as quantum computing where accurate QD positioning and low degree of dislocations are required. We theoretically demonstrate that high-density three-dimensional (3-D) arrays of self-assembled Ge nanoparticles, with a size of some nanometers, in Si can also show a very low thermal conductivity in the three spatial directions. This property can now be considered to design new thermoelectric devices, which are compatible with new complementary metal-oxide-semiconductor (CMOS) processes. To obtain a computationally manageable model of these nanomaterials, we simulate their thermal behavior with atomic-scale 3-D phononic crystals. A phononic-crystal period or supercell consists of diamond-like Si cells. At each supercell center, we substitute Si atoms by Ge atoms in a given number of cells to form a box-like nanoparticle. According to our model, in an example 3-D phononic crystal, the thermal conductivity can be reduced to a value lower than only 0.2 W/mK or by a factor of at least 750 compared to bulk Si at 300 K. This value is five times smaller than the Einstein Limit of single-crystalline bulk Si. We considered the flat dispersion curves computed by lattice dynamics to obtain this huge decrease. However, we did not consider multiple-scattering effects as multiple reflections and diffusions of the phonons between the Ge nanoparticles. We expect a larger decrease of the real thermal conductivity owing to the reduction of the phonon mean free paths from these collective effects. We hope to obtain a large ZT in these self-assembled Ge nanoparticle arrays in Si. Indeed, they are crystalline with an electrical conductivity that can be also increased by doping using CMOS processes, which is not possible with other recently proposed materials.

Copyright © 2008 by ASME

Figures

Tables

Interactive Graphics

Video

Country-Specific Mortality and Growth Failure in Infancy and Yound Children and Association With Material Stature

Use interactive graphics and maps to view and sort country-specific infant and early dhildhood mortality and growth failure data and their association with maternal

NOTE:
Citing articles are presented as examples only. In non-demo SCM6 implementation, integration with CrossRef’s "Cited By" API will populate this tab (http://www.crossref.org/citedby.html).

Some tools below are only available to our subscribers or users with an online account.

Related Content

Customize your page view by dragging and repositioning the boxes below.

Related eBook Content
Topic Collections

Sorry! You do not have access to this content. For assistance or to subscribe, please contact us:

  • TELEPHONE: 1-800-843-2763 (Toll-free in the USA)
  • EMAIL: asmedigitalcollection@asme.org
Sign In