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A Honeycomb Micro Channel Cooling System for Electronics Cooling

[+] Author Affiliations
Xiaobing Luo, Wei Liu

Huazhong University of Science and Technology, Wuhan, China

Yonglu Liu

Huazhong University of Science and Technology, Wuhan; Nanchang Institute of Technology, Nanchang, China

Paper No. ICNMM2009-82058, pp. 261-265; 5 pages
  • ASME 2009 7th International Conference on Nanochannels, Microchannels, and Minichannels
  • ASME 2009 7th International Conference on Nanochannels, Microchannels and Minichannels
  • Pohang, South Korea, June 22–24, 2009
  • Conference Sponsors: Nanotechnology Institute
  • ISBN: 978-0-7918-4349-9 | eISBN: 978-0-7918-3850-1
  • Copyright © 2009 by ASME


A honeycomb porous micro channel cooling system for cooling of electronic chips is proposed in this paper. The design, fabrication, test system configuration of the micro channel heat sink is summarized. Preliminary experimental investigation is conducted to determine the heat transfer characteristics and cooling performance under steady single-phase flow of water liquid. In the experiments, the brass micro channel heat sink is attached to a test heater with 8cm2 area, the experimental results show that the cooling system can effectively remove the heat flux of 18.2W/cm2 under 2.4W pumping power, while the junction-wall temperature is 48.3°C at the room temperature of 26°C. The experimental results show that the present cooling system has good performance.

Copyright © 2009 by ASME



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