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Study on Condensation Heat Transfer of Micro Structured Surfaces

[+] Author Affiliations
Hiroyasu Ohtake, Soichiro Miyake

Kogakuin University, Tokyo, Japan

Yasuo Koizumi

Shinshu University, Tokyo, Japan

Paper No. ICNMM2009-82111, pp. 49-52; 4 pages
doi:10.1115/ICNMM2009-82111
From:
  • ASME 2009 7th International Conference on Nanochannels, Microchannels, and Minichannels
  • ASME 2009 7th International Conference on Nanochannels, Microchannels and Minichannels
  • Pohang, South Korea, June 22–24, 2009
  • Conference Sponsors: Nanotechnology Institute
  • ISBN: 978-0-7918-4349-9 | eISBN: 978-0-7918-3850-1
  • Copyright © 2009 by ASME

abstract

Condensation heat transfer experiments for steam were performed by using mirror-finished copper surfaces, mirror-finished silicon surfaces and silicon surfaces with micro grooves or micro pins on it. The micro-grooves and the micro-pins were created by the MEMS technology. The film- and also the drop-wise condensation were observed on the copper surface. The film-wise condensation heat flux was in good agreement with the values of the Nusselt equation. It was approximately one-tenth of the drop-wise condensation heat flux. The condensation on the mirror-finished silicon surface was the drop-wise condensation. The heat flux was approximately one-tenth of the drop-wise condensation heat flux on the copper surface. The condensation on the micro-grooved and the micro-pin silicon surfaces was film-wise. The condensation heat fluxes were approximately one-tenth of the copper surface film-wise condensation heat flux. When the contact angle was smaller than 70 degree, the condensation was film-wise and when larger than the value, drop-wise. It seemed that the hollow parts of the micro-grooved or the micro-pin surface were filled with condensate first after the condensation was initiated. It made the surface hydrophilic and the condensation film-wise.

Copyright © 2009 by ASME

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