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Mass Transfer During Fluid Sphere Dissolution in an Alternating Electric Field

[+] Author Affiliations
Tov Elperin, Andrew Fominykh

Ben-Gurion University of the Negev, Beer Sheva, Israel

Zakhar Orenbakh

Negev Academic College of Engineering, Beer Sheva, Israel

Paper No. HT-FED2004-56270, pp. 567-574; 8 pages
doi:10.1115/HT-FED2004-56270
From:
  • ASME 2004 Heat Transfer/Fluids Engineering Summer Conference
  • Volume 3
  • Charlotte, North Carolina, USA, July 11–15, 2004
  • Conference Sponsors: Heat Transfer Division and Fluids Engineering Division
  • ISBN: 0-7918-4692-X | eISBN: 0-7918-3740-8
  • Copyright © 2004 by ASME

abstract

In this study we considered mass transfer in a binary system comprising a stationary fluid dielectric sphere embedded into an immiscible dielectric liquid under the influence of an alternating electric field. Fluid sphere is assumed to be solvent-saturated so that an internal resistance to mass transfer can be neglected. Mass flux is directed from a fluid sphere to a host medium, and the applied electric field causes a creeping flow around the sphere. Droplet deformation under the influence of the electric field is neglected. The problem is solved in the approximations of a thin concentration boundary layer and finite dilution of a solute in the solvent. The thermodynamic parameters of a system are assumed constant. The nonlinear partial parabolic differential equation of convective diffusion is solved by means of a generalized similarity transformation, and the solution is obtained in a closed analytical form for all frequencies of the applied electric field. The rates of mass transfer are calculated for both directions of fluid motion — from the poles to equator and from the equator to the poles. Numerical calculations show essential (by a factor of 2–3) enhancement of the rate of mass transfer in water droplet–benzonitrile and droplet of carbontetrachloride–glycerol systems under the influence of electric field for a stagnant droplet. The asymptotics of the obtained solutions are discussed.

Copyright © 2004 by ASME

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