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Microvia Formation for Multi-Layer PWB by Laser Direct Drilling: Improvement of Hole Quality by Silica Fillers in Build-Up Layer

[+] Author Affiliations
Keiji Ogawa

The University of Shiga Prefecture, Hikone, Shiga, Japan

Toshiki Hirogaki, Eiichi Aoyama, Kuniyoshi Obata, Tsukasa Ayuzawa

Doshisha University, Kyotanabe, Kyoto, Japan

Paper No. MSEC2011-50222, pp. 419-428; 10 pages
doi:10.1115/MSEC2011-50222
From:
  • ASME 2011 International Manufacturing Science and Engineering Conference
  • ASME 2011 International Manufacturing Science and Engineering Conference, Volume 2
  • Corvallis, Oregon, USA, June 13–17, 2011
  • ISBN: 978-0-7918-4431-1
  • Copyright © 2011 by ASME

abstract

Microvia formation technology using lasers has become the dominant method for drilling microvia called blind via-holes (BVHs) in printed wiring boards (PWBs). Laser direct drilling (LDD), drilling directly outer copper foil by laser, has attracted attention as a novel method. In particular, when copper and resin with different processing thresholds are drilled at the same time, an overhang defect occurs on the drilled hole. However, the overhang generation mechanism has not been clarified. Therefore, we investigated it by detailed observation of the drilled-hole section. Moreover, the overhang length was estimated using the finite element method (FEM). Influences of surface treatment of outer copper foil and thermal properties of the build-up layer were evaluated experimentally and analytically. Consequently, an experiment with a prototype PWB with silica filler added in the build-up layer was carried out. Using the prototype PWBs, the overhang was reduced as shown in FEM analysis results.

Copyright © 2011 by ASME

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