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Ultrasonic-Vibration-Assisted Grinding of Brittle Materials: A Mechanistic Model for Cutting Force

[+] Author Affiliations
Na Qin

Dalian University of Technology, Dalian, Liaoning, China; Kansas State Univeristy, Manhattan, KS

Z. J. Pei, W. L. Cong

Kansas State University, Manhattan, KS

C. Treadwell

Sonic-Mill, Albuquerque, NM

D. M. Guo

Dalian University of Technology, Dalian, Liaoning, China

Paper No. MSEC2011-50055, pp. 127-136; 10 pages
doi:10.1115/MSEC2011-50055
From:
  • ASME 2011 International Manufacturing Science and Engineering Conference
  • ASME 2011 International Manufacturing Science and Engineering Conference, Volume 1
  • Corvallis, Oregon, USA, June 13–17, 2011
  • ISBN: 978-0-7918-4430-4
  • Copyright © 2011 by ASME

abstract

A mechanistic model for cutting force in ultrasonic-vibration-assisted grinding (UVAG) (also called rotary ultrasonic machining) of brittle materials is proposed for the first time. Fundamental assumptions include: (1) brittle fracture is the dominant mechanism of material removal, and (2) the removed volume by each diamond grain in one vibration cycle can be related to its indentation volume in the workpiece through a mechanistic parameter. Experiments with UVAG of silicon are conducted to determine the mechanistic parameter for silicon. With the developed model, influences of six input variables on cutting force are predicted. These predicted influences trends are also compared with those determined experimentally for several brittle materials.

Copyright © 2011 by ASME

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