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Investigation on the Effects of Copper Electroplating Process

[+] Author Affiliations
Yue Chen, Shi Qing Chen, Haixia Zhang

Peking University, Beijing, China

Xiuhan Li

Peking University; Beijing Jiaotong University, Beijing, China

Paper No. MicroNano2008-70132, pp. 619-622; 4 pages
doi:10.1115/MicroNano2008-70132
From:
  • 2008 Second International Conference on Integration and Commercialization of Micro and Nanosystems
  • 2008 Second International Conference on Integration and Commercialization of Micro and Nanosystems
  • Clear Water Bay, Kowloon, Hong Kong, June 3–5, 2008
  • Conference Sponsors: Nanotechnology Institute
  • ISBN: 0-7918-4294-0 | eISBN: 0-7918-3819-6
  • Copyright © 2008 by ASME

abstract

This paper mainly discusses DC electroplating process parameter, especially the current density, affects the electroplating result (such as copper grain, surface smooth, resistivity). A positive relationship has been found between the current density and the electrodepositing speed, copper grain diameter, core cluster as well as square resistivity. Furthermore, testing structures are designed to monitor the process on line. And an observation of fluctuation along the transection has been found which is also increased with the current density.

Copyright © 2008 by ASME

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