Full Content is available to subscribers

Subscribe/Learn More  >

Study of Package Technologies for Implantable Microdevices

[+] Author Affiliations
Weihong Li, Zhenjiang Shi, Hang Guo

Xiamen University, Xiamen, Fujian, China

Shiqing Chen, Xiuhan Li, Haixia Zhang

Peking University, Beijing, China

Paper No. MicroNano2008-70194, pp. 167-170; 4 pages
  • 2008 Second International Conference on Integration and Commercialization of Micro and Nanosystems
  • 2008 Second International Conference on Integration and Commercialization of Micro and Nanosystems
  • Clear Water Bay, Kowloon, Hong Kong, June 3–5, 2008
  • Conference Sponsors: Nanotechnology Institute
  • ISBN: 0-7918-4294-0 | eISBN: 0-7918-3819-6
  • Copyright © 2008 by ASME


This paper presents a study of packaging technologies for implantable microdevices. A RF microcoil is first designed and fabricated for implantable microdevices. Then, two methods using different materials and technologies for packaging have been developed. A RLC resonance circuit is adopted to test packaging performance. Measured results accord well with the predicted results from the circuit model and show that the method using multilayer Six Ny -SiO2 -Six Ny dielectric thin films and silicone have better packaging performance to let the implanted microdevice be able to work chronically.

Copyright © 2008 by ASME



Interactive Graphics


Country-Specific Mortality and Growth Failure in Infancy and Yound Children and Association With Material Stature

Use interactive graphics and maps to view and sort country-specific infant and early dhildhood mortality and growth failure data and their association with maternal

Citing articles are presented as examples only. In non-demo SCM6 implementation, integration with CrossRef’s "Cited By" API will populate this tab (http://www.crossref.org/citedby.html).

Some tools below are only available to our subscribers or users with an online account.

Related Content

Customize your page view by dragging and repositioning the boxes below.

Related eBook Content
Topic Collections

Sorry! You do not have access to this content. For assistance or to subscribe, please contact us:

  • TELEPHONE: 1-800-843-2763 (Toll-free in the USA)
  • EMAIL: asmedigitalcollection@asme.org
Sign In