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Study of Package Technologies for Implantable Microdevices

[+] Author Affiliations
Weihong Li, Zhenjiang Shi, Hang Guo

Xiamen University, Xiamen, Fujian, China

Shiqing Chen, Xiuhan Li, Haixia Zhang

Peking University, Beijing, China

Paper No. MicroNano2008-70194, pp. 167-170; 4 pages
doi:10.1115/MicroNano2008-70194
From:
  • 2008 Second International Conference on Integration and Commercialization of Micro and Nanosystems
  • 2008 Second International Conference on Integration and Commercialization of Micro and Nanosystems
  • Clear Water Bay, Kowloon, Hong Kong, June 3–5, 2008
  • Conference Sponsors: Nanotechnology Institute
  • ISBN: 0-7918-4294-0 | eISBN: 0-7918-3819-6
  • Copyright © 2008 by ASME

abstract

This paper presents a study of packaging technologies for implantable microdevices. A RF microcoil is first designed and fabricated for implantable microdevices. Then, two methods using different materials and technologies for packaging have been developed. A RLC resonance circuit is adopted to test packaging performance. Measured results accord well with the predicted results from the circuit model and show that the method using multilayer Six Ny -SiO2 -Six Ny dielectric thin films and silicone have better packaging performance to let the implanted microdevice be able to work chronically.

Copyright © 2008 by ASME

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