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Design and Fabrication of Uncooled MEMS Capacitive FPA for IR Imaging

[+] Author Affiliations
Shenglin Ma, Yuliang Yi, Yaquan Tang, Xiaomei Yu

Peking University, Beijing, China

Paper No. MicroNano2008-70128, pp. 61-64; 4 pages
doi:10.1115/MicroNano2008-70128
From:
  • 2008 Second International Conference on Integration and Commercialization of Micro and Nanosystems
  • 2008 Second International Conference on Integration and Commercialization of Micro and Nanosystems
  • Clear Water Bay, Kowloon, Hong Kong, June 3–5, 2008
  • Conference Sponsors: Nanotechnology Institute
  • ISBN: 0-7918-4294-0 | eISBN: 0-7918-3819-6
  • Copyright © 2008 by ASME

abstract

A new structure of MEMS Uncooled capacitive focal plane array (FPA) is presented and its thermo-mechanical behaviors are studied. A surface process with poly-silicon as a sacrificial layer was developed, and in which poly-silicon was dry etched by SF6 in an ICP system of STS. The etching rates of poly-silicon in lateral and vertical can reach 3.8 and 5.6μm/min after the optimization of the process. The process is simple and compatible with most of the IC processes.

Copyright © 2008 by ASME

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