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Thermal Conductivity and Operating Temperature Effect on the Interline Region in a Micro/Miniature Heat Pipe

[+] Author Affiliations
Hani H. Sait

Jeddah College of Technology, Jeddah, Saudi Arabia

Steve M. Demsky, HongBin Ma

University of Missouri, Columbia, MO

Paper No. MNHT2008-52043, pp. 941-962; 22 pages
doi:10.1115/MNHT2008-52043
From:
  • ASME 2008 First International Conference on Micro/Nanoscale Heat Transfer
  • ASME 2008 First International Conference on Micro/Nanoscale Heat Transfer, Parts A and B
  • Tainan, Taiwan, June 6–9, 2008
  • Conference Sponsors: Nanotechnology Institute
  • ISBN: 0-7918-4292-4 | eISBN: 0-7918-3813-7
  • Copyright © 2008 by ASME

abstract

An analytical model describing thin film evaporation is developed that includes the effects of surface tension, frictional shear stress, wetting characteristics and disjoining pressure. The effects of thermal conductivity of working fluids and operating temperature on the evaporating thin film region are also studied. The results indicate that when the thermal conductivity of the working fluid increases, a high heat flux can be removed from the evaporating thin film region. The operating temperature affects the thin film evaporation. The higher the operating temperature, the more heat flux can be removed from the region. The information of thin film evaporation presented in the paper results in a better understanding of heat transfer mechanism occurring in micro heat pipes.

Copyright © 2008 by ASME

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