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Effect of pH and Chemical Surfactant on Thermal Conductivity Enhancement of Cu-H2O Nanofluids

[+] Author Affiliations
Xinfang Li, Dongsheng Zhu

South China University of Technology, Guangzhou, Guangdong, China

Xianju Wang

South China University of Technology; Navy Arms of Services Command Academy, Guangzhou, Guangdong, China

Nan Wang

South China University of Science Technology, Guangzhou, Guangdong, China

Zhengdong Wang

East China University of Science Technology, Shanghai, China

Shandong Tu

East China University of Technology, Shanghai, China

Paper No. MNHT2008-52271, pp. 569-573; 5 pages
doi:10.1115/MNHT2008-52271
From:
  • ASME 2008 First International Conference on Micro/Nanoscale Heat Transfer
  • ASME 2008 First International Conference on Micro/Nanoscale Heat Transfer, Parts A and B
  • Tainan, Taiwan, June 6–9, 2008
  • Conference Sponsors: Nanotechnology Institute
  • ISBN: 0-7918-4292-4 | eISBN: 0-7918-3813-7
  • Copyright © 2008 by ASME

abstract

Nanofluids have been attractive for the last few years with the enormous potential to improve the efficiency of heat transfer fluids. This work focuses on the effect of pH and sodium dodecylbenzenesulfonate (SDBS) surfactant on the thermal conductivity of nanofluids.The thermal conductivity was measured by a Hot Disk Thermal Constants Anlyser. The results showed that the thermal conductivity enhancements of Cu–H2 O nanofluids are highly dependent on the weight fraction of nanoparticle, pH values and SDBS surfactant concentration of nano-suspensions. The Cu–H2 O nanofluids with an ounce of Cu have noticeably higher thermal conductivity than the base fluid without nanoparticles, For Cu nanoparticles at a weight fraction of 0.001 (0.1 wt %), thermal conductivity was enhanced by up to 10.7%, with an optimal pH value and SDBS concentration for the highest thermal conductivity. Therefore, the combined treatment with both the pH and chemical surfactant is recommended to improve the thermal conductivity for practical applications of nanofluid.

Copyright © 2008 by ASME

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