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Finite Element Modeling of Multi-Scale Thermal Contact Resistance

[+] Author Affiliations
M. K. Thompson

Korea Advanced Institute of Science and Technology, Daejeon, South Korea

Paper No. MNHT2008-52385, pp. 509-517; 9 pages
  • ASME 2008 First International Conference on Micro/Nanoscale Heat Transfer
  • ASME 2008 First International Conference on Micro/Nanoscale Heat Transfer, Parts A and B
  • Tainan, Taiwan, June 6–9, 2008
  • Conference Sponsors: Nanotechnology Institute
  • ISBN: 0-7918-4292-4 | eISBN: 0-7918-3813-7
  • Copyright © 2008 by ASME


Many traditional macro scale finite element models of thermal contact systems have incorporated the effect of micro scale surface topography by applying a constant value of thermal contact conductance (TCC) per unit area to the regions in contact. However, it has been very difficult to determine an appropriate TCC value for a given system and analysts typically had to rely on experimental data or values from the literature. This work presents a method for predicting micro scale TCC per unit area by incorporating micro scale surface roughness in a multi-scale iterative thermal/structural finite element contact model. The resulting TCC value is then used in a macro scale thermal/structural contact model with apparent surface form to predict the thermal contact resistance and overall thermal resistance for a commercial power electronics module.

Copyright © 2008 by ASME



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