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Improving Biocompatibily of Laser Micromachined Silicon Wafer by Surface Coating With Poly(Ethylene Glycol) Diacrylate and Diamond-Like Carbon for Biomedical Devices

[+] Author Affiliations
Plawut Wongwiwat, Yuan-Shin Lee

North Carolina State University, Raleigh, NC

Roger J. Narayan

University of North Carolina, Chapel Hill, NC

Paper No. MSEC2010-34283, pp. 273-280; 8 pages
  • ASME 2010 International Manufacturing Science and Engineering Conference
  • ASME 2010 International Manufacturing Science and Engineering Conference, Volume 2
  • Erie, Pennsylvania, USA, October 12–15, 2010
  • Conference Sponsors: Manufacturing Engineering Division
  • ISBN: 978-0-7918-4947-7 | eISBN: 978-0-7918-3887-7
  • Copyright © 2010 by ASME


This paper presents a study of laser micromachining and the effect of the micromachined regions on the biocompatibility in the protein adsorption for medical devices applications. From the study, the surface roughness on the micromachined area promoted the protein adsorption so it probably causes the thrombus formation for the application in the cardiovascular or blood related devices. In contrast, this incident can enhance the cell promotion that is helpful for the biomedical implant MEMS devices. To modify the surface property in biocompatibility, both Diamond-like carbon (DLC) coating and Poly ethylene glycol diacrylate (PEGDA), the protein resistant and biocompatible materials, were proposed in this research. The UV lithography for coating PEGDA and Pulse laser deposition for coating DLC on the laser micromachined substrates were applied while the coated substrates were biocompatibility tested with the Bovine Serum Albumin (BSA) to observe the protein adsorption. To image the quantity of adsorption, the fluorescein labeled BSA was used for fluorescent microscope to clearly image the reflective light. This study proposed a good opportunity for major novel techniques such as laser micromachining, PLD and UV lithography in developing and prototyping biocompatible MEMS devices.

Copyright © 2010 by ASME



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