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Simulation of Diamond Disc Conditioning in Chemical Mechanical Polishing: Effects of Conditioning Parameters on Pad Surface Shape

[+] Author Affiliations
Emmanuel A. Baisie, Z. C. Li

North Carolina Agricultural & Technical State University, Greensboro, NC

X. H. Zhang

Seagate Technology, Minneapolis, MN

Paper No. MSEC2010-34264, pp. 169-177; 9 pages
doi:10.1115/MSEC2010-34264
From:
  • ASME 2010 International Manufacturing Science and Engineering Conference
  • ASME 2010 International Manufacturing Science and Engineering Conference, Volume 2
  • Erie, Pennsylvania, USA, October 12–15, 2010
  • Conference Sponsors: Manufacturing Engineering Division
  • ISBN: 978-0-7918-4947-7 | eISBN: 978-0-7918-3887-7
  • Copyright © 2010 by ASME

abstract

Diamond disc conditioning is traditionally employed to restore pad planarity and surface roughness in chemical mechanical polishing (CMP). In this paper, a mathematic model is developed by using a surface element method to simulate and predict the pad surface shape resulted from diamond disc conditioning. The developed model is then validated by published experimental data. Three metrics (total thickness variation (TTV), bow and non-uniformity (NU)) are defined and utilized to evaluate the pad surface shape. Based upon the validated model, effects of conditioning parameters (including sweeping profile, pad rotating speed, conditioner rotating speed, and conditioner diameter) on the pad surface shape are further investigated and discussed.

Copyright © 2010 by ASME

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