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Experimental and Numerical Analysis of Droplet Cooling

[+] Author Affiliations
Paolo Tartarini, Mauro A. Corticelli, Paolo E. Santangelo

Università degli Studi di Modena e Reggio Emilia, Modena, Italy

Paper No. IHTC14-22217, pp. 677-685; 9 pages
  • 2010 14th International Heat Transfer Conference
  • 2010 14th International Heat Transfer Conference, Volume 6
  • Washington, DC, USA, August 8–13, 2010
  • Conference Sponsors: Heat Transfer Division
  • ISBN: 978-0-7918-4941-5 | eISBN: 978-0-7918-3879-2
  • Copyright © 2010 by ASME


Dropwise cooling represents a major subject of interest for both academic and industrial researches. The present work is focused on investigating the thermal transient occurring as two water droplets are gently released (We < 30) onto a heated solid surface. This latter has been kept at initial temperature lower than 373.15 K to analyze the single-phase-evaporation regime. To the purpose, both an experimental and a numerical approach have conveniently been employed. Infrared thermography has been used to evaluate the temperature trend at the solid-liquid interface: an experimental facility has been built to carry out measurements from below, thus realizing a fully non-intrusive approach. A transparent-crystal disk has been inserted to serve as the solid substrate; its upper surface has been painted by a black coating, thus providing a black-body surface as the solid-liquid interface. The infrared thermocamera has been placed below and perpendicular to that surface; temperature has been thereby measured, being emissivity a known parameter. A numerical code has been developed to predict the involved physical phenomena: temperature trend, evaporation time and evaporated flux result from discretizing the three-dimensional energy-diffusion equation by the finite-volume method. Moreover, the model is based on structured non-uniform mesh to adapt to the occurring temperature gradients. Very good agreement is shown between experimental and numerical outcomes in terms of thermal transient and recovery.

Copyright © 2010 by ASME



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