Full Content is available to subscribers

Subscribe/Learn More  >

Simulation of Electron Beam Heating of a Cu Thin Film on a Si Substrate

[+] Author Affiliations
Vance S. Robinson, Xi Zhang, Forrest Hopkins

GE Global Research Center, Niskayuna, NY

Paper No. IHTC14-23333, pp. 545-549; 5 pages
  • 2010 14th International Heat Transfer Conference
  • 2010 14th International Heat Transfer Conference, Volume 6
  • Washington, DC, USA, August 8–13, 2010
  • Conference Sponsors: Heat Transfer Division
  • ISBN: 978-0-7918-4941-5 | eISBN: 978-0-7918-3879-2
  • Copyright © 2010 by ASME


Electron beam interaction with thin films is a critical phenomenon in applications such as nanostructure fabrication, surface treatment and curing, surface sterilization, scanning electron microscopy, and electron beam lithography. Unlike bulk solids, thin films whose thickness is on the same order of magnitude as the penetration depth require consideration of interface effects: namely resistance to heat transfer and more electron scattering. In such cases, the energy deposition profile, the location of interfaces and the associated change in material properties must be accounted for. In this paper we describe the thermal simulation of a thin copper film (0.5 μm, 1 μm, 2μm) on a Si substrate irradiated by an electron beam (10 keV, 20 keV, 40 keV). We explore the effect of the interface position relative to the electron range and the local heating effects associated with continuous or long pulse beams.

Copyright © 2010 by ASME



Interactive Graphics


Country-Specific Mortality and Growth Failure in Infancy and Yound Children and Association With Material Stature

Use interactive graphics and maps to view and sort country-specific infant and early dhildhood mortality and growth failure data and their association with maternal

Citing articles are presented as examples only. In non-demo SCM6 implementation, integration with CrossRef’s "Cited By" API will populate this tab (http://www.crossref.org/citedby.html).

Some tools below are only available to our subscribers or users with an online account.

Related Content

Customize your page view by dragging and repositioning the boxes below.

Related eBook Content
Topic Collections

Sorry! You do not have access to this content. For assistance or to subscribe, please contact us:

  • TELEPHONE: 1-800-843-2763 (Toll-free in the USA)
  • EMAIL: asmedigitalcollection@asme.org
Sign In