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Measurement of Liquid Film Thickness in Micro Tube Annular Flow

[+] Author Affiliations
Hiroshi Kanno, Youngbae Han, Yusuke Saito, Naoki Shikazono

University of Tokyo, Tokyo, Japan

Paper No. IHTC14-23176, pp. 245-252; 8 pages
doi:10.1115/IHTC14-23176
From:
  • 2010 14th International Heat Transfer Conference
  • 2010 14th International Heat Transfer Conference, Volume 6
  • Washington, DC, USA, August 8–13, 2010
  • Conference Sponsors: Heat Transfer Division
  • ISBN: 978-0-7918-4941-5 | eISBN: 978-0-7918-3879-2
  • Copyright © 2010 by ASME

abstract

Heat transfer in micro scale two-phase flow attracts large attention since it can achieve large heat transfer area per density. At high quality, annular flow becomes one of the major flow regimes in micro two-phase flow. Heat is transferred by evaporation or condensation of the liquid film, which are the dominant mechanisms of micro scale heat transfer. Therefore, liquid film thickness is one of the most important parameters in modeling the phenomena. In macro tubes, large numbers of researches have been conducted to investigate the liquid film thickness. However, in micro tubes, quantitative information for the annular liquid film thickness is still limited. In the present study, annular liquid film thickness is measured using a confocal method, which is used in the previous study [1, 2]. Glass tubes with inner diameters of 0.3, 0.5 and 1.0 mm are used. Degassed water and FC40 are used as working fluids, and the total mass flux is varied from G = 100 to 500 kg/m2 s. Liquid film thickness is measured by laser confocal displacement meter (LCDM), and the liquid-gas interface profile is observed by a high-speed camera. Mean liquid film thickness is then plotted against quality for different flow rates and tube diameters. Mean thickness data is compared with the smooth annular film model of Revellin et al. [3]. Annular film model predictions overestimated the experimental values especially at low quality. It is considered that this overestimation is attributed to the disturbances caused by the interface ripples.

Copyright © 2010 by ASME

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