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Surface Functionalization Mechanisms of Enhancing Heat Transfer at Solid-Liquid Interfaces

[+] Author Affiliations
Ming Hu

ETH Zurich, Zurich; IBM Research GmbH, Rüschlikon, Switzerland

Javier V. Goicochea, Bruno Michel

IBM Research GmbH, Rüschlikon, Switzerland

Dimos Poulikakos

ETH Zurich, Zurich, Switzerland

Paper No. IHTC14-22362, pp. 791-796; 6 pages
doi:10.1115/IHTC14-22362
From:
  • 2010 14th International Heat Transfer Conference
  • 2010 14th International Heat Transfer Conference, Volume 3
  • Washington, DC, USA, August 8–13, 2010
  • Conference Sponsors: Heat Transfer Division
  • ISBN: 978-0-7918-4938-5 | eISBN: 978-0-7918-3879-2
  • Copyright © 2010 by ASME

abstract

Two mechanisms that increase heat dissipation at solid-liquid interfaces are investigated from the atomistic point of view using nonequilibrium molecular dynamics (NEMD) simulation. The mechanisms include surface functionalization, where −OH terminated headgroups and self-assembled monolayers (SAMs) with different chain lengths are used to recondition and modify the hydrophilicity of silica surface, and vibrational matching between crystalline silica and liquid water, where three-dimensional quartz nanopillars are grown at the interface in the direction of the heat flux with different lengths to rectify the vibrational frequencies of quartz surface atoms. The heat dissipation is measured in terms of the interfacial thermal conductance at the solid-liquid interface, whereas the thermal conductance is obtained by imposing a one-dimensional heat flux across the simulation domain. The heat dissipation is enhanced by a factor of 2 to 3 for both fully hydroxylated and pillar modified surfaces. The SAMs enhance the overall thermal conductance between silica and water further (20% higher thermal conductance compared to the fully hydroxylated silica surface). Moreover, the modification of the vibrational states at the silica surface provides a tunable path to enhance the heat dissipation, which can also be easily applied to other fluids.

Copyright © 2010 by ASME

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