0

Full Content is available to subscribers

Subscribe/Learn More  >

Optimization of Concentration and Temperature of KOH Etchant on Micromachining Process

[+] Author Affiliations
Mohsen Shayan, Behrooz Arezoo, Ali Amani

Amirkabir University of Technology, Tehran, Iran

Paper No. ESDA2010-25226, pp. 691-695; 5 pages
doi:10.1115/ESDA2010-25226
From:
  • ASME 2010 10th Biennial Conference on Engineering Systems Design and Analysis
  • ASME 2010 10th Biennial Conference on Engineering Systems Design and Analysis, Volume 5
  • Istanbul, Turkey, July 12–14, 2010
  • Conference Sponsors: International
  • ISBN: 978-0-7918-4919-4 | eISBN: 978-0-7918-3877-8
  • Copyright © 2010 by ASME

abstract

Due to vast application of silicon wet etching in Micromachining and MEMS structure, investigation about parameters that have more influence on wet etch rate is indispensable. Wet etch rate is dependent to several factor such as temperature, etchant concentration and crystal orientation. Because of temperature and concentration are more controllable therefore the etch rates R{hkl} depend mainly on concentration and temperature of the etchant. Understanding the relation between this parameters and wet etch rate can assist us in order to control and optimization of micromachining process. This paper present a relation between etchant concentration and temperature and wet etch rate on (100) plane, and then identify the etchant concentration in a certain range of temperature as the wet etch rate be in optimal amount. With optimization the etch rate of wafer (100), necessary time for etching process reduces and this reduction of time can lead to reduction of undercutting at convex and concave corners.

Copyright © 2010 by ASME

Figures

Tables

Interactive Graphics

Video

Country-Specific Mortality and Growth Failure in Infancy and Yound Children and Association With Material Stature

Use interactive graphics and maps to view and sort country-specific infant and early dhildhood mortality and growth failure data and their association with maternal

NOTE:
Citing articles are presented as examples only. In non-demo SCM6 implementation, integration with CrossRef’s "Cited By" API will populate this tab (http://www.crossref.org/citedby.html).

Some tools below are only available to our subscribers or users with an online account.

Related Content

Customize your page view by dragging and repositioning the boxes below.

Related eBook Content
Topic Collections

Sorry! You do not have access to this content. For assistance or to subscribe, please contact us:

  • TELEPHONE: 1-800-843-2763 (Toll-free in the USA)
  • EMAIL: asmedigitalcollection@asme.org
Sign In