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The Effect of Temperature on the Etch Rate and Roughness of Surfaces Etched With XEF2

[+] Author Affiliations
Joseph Butner, Zayd C. Leseman

University of New Mexico, Albuquerque, NM

Paper No. IMECE2010-38971, pp. 565-568; 4 pages
  • ASME 2010 International Mechanical Engineering Congress and Exposition
  • Volume 10: Micro and Nano Systems
  • Vancouver, British Columbia, Canada, November 12–18, 2010
  • Conference Sponsors: ASME
  • ISBN: 978-0-7918-4447-2
  • Copyright © 2010 by ASME


In this work we present results from a pulsed etching system with XeF2 for an expanded temperature range while at the same time determining the roughness of the substrate left behind. The experimental apparatus used for the work presented in this paper is capable of temperature ranges from approximately 100 to 800 K. Data was taken at a constant etching pressure of 1.2 Torr so the effect of temperature on roughness and etch rate could be studied. Etch rates and surface roughnesses were characterized using a vertical scanning and phase shifting interferometer, respectively.

Copyright © 2010 by ASME



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