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Characterization of Laser Processed Sub-Millimeter Lap Joints Between Copper and Aluminum Under Tensile Load

[+] Author Affiliations
A. Mian

Montana State University, Bozeman, MT

M. Hailat, G. Newaz

Wayne State University, Detroit, MI

R. Patwa, H. Herfurth

Fraunhafer CLT USA, Plymouth, MI

Paper No. IMECE2010-40590, pp. 71-74; 4 pages
doi:10.1115/IMECE2010-40590
From:
  • ASME 2010 International Mechanical Engineering Congress and Exposition
  • Volume 10: Micro and Nano Systems
  • Vancouver, British Columbia, Canada, November 12–18, 2010
  • Conference Sponsors: ASME
  • ISBN: 978-0-7918-4447-2
  • Copyright © 2010 by ASME

abstract

This paper presents the results of laser joined copper-aluminum lap shear samples without filler materials using an IPG 500W SM fiber laser. The length of the processed laser joint was about 20 mm and the width was about 200 μm. Laser-joined samples were tested under tensile loading to determine joint strengths. In addition, finite element analysis (FEA) was conducted to understand the stress distribution within the bond area under such loading. The FEA model provides a full-field stress distribution in and around the joint that cause eventual failure. We are still working on the topic, and more data will be published soon.

Copyright © 2010 by ASME
Topics: Copper , Aluminum , Lasers , Stress

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