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A Load-Based Depth-Sensing Indentation Technique for Elastic-Plastic Material Mechanical Property Evaluation

[+] Author Affiliations
K. Lee, J. M. Tannenbaum, B. S.-J. Kang

West Virginia University, Morgantown, WV

M. A. Alvin

U.S. Department of Energy, Pittsburgh, PA

Paper No. IMECE2010-37698, pp. 9-17; 9 pages
  • ASME 2010 International Mechanical Engineering Congress and Exposition
  • Volume 10: Micro and Nano Systems
  • Vancouver, British Columbia, Canada, November 12–18, 2010
  • Conference Sponsors: ASME
  • ISBN: 978-0-7918-4447-2
  • Copyright © 2010 by ASME


A load-based depth-sensing micro-indentation technique has been developed for material mechanical properties evaluation including elastic modulus, yield stress, strain hardening exponent and stress-strain curve. Based on a Hertzian contact mechanics approach, this load-based depth-sensing micro-indentation technique does not require system compliance calibration or the use of high precision depth sensors. Furthermore a unique, material independent, indentation based load-depth algorithm has been developed accounting for both elastic and elastic-plastic deformation of the material beneath the indenter. This algorithm, found to be a function of material yield stress, strain hardening exponent and elastic modulus, is shown to be the basis for obtaining a stress-strain curve. Finite element analyses of multiple materials with various mechanical properties were employed to examine and develop the fundamental indention based relationships between these variables and the load/depth curve needed to extract the stress-strain diagram. In addition, experimental results obtained with this load-based micro-indentation technique were found to yield accurate material mechanical properties (elastic modulus, strain hardening, yield strength) at room and elevated temperatures (up to 1200°C).

Copyright © 2010 by ASME



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