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Dynamic Stress Intensity Factor for an Interfacial Crack on a Circular Cavity in Piezoelectric Media

[+] Author Affiliations
Tianshu Song, Dong Li, Tamman Merhej

Harbin Engineering University, Harbin, China

Paper No. IMECE2010-37476, pp. 257-262; 6 pages
doi:10.1115/IMECE2010-37476
From:
  • ASME 2010 International Mechanical Engineering Congress and Exposition
  • Volume 8: Dynamic Systems and Control, Parts A and B
  • Vancouver, British Columbia, Canada, November 12–18, 2010
  • Conference Sponsors: ASME
  • ISBN: 978-0-7918-4445-8
  • Copyright © 2010 by ASME

abstract

Dynamic stress intensity factor is investigated theoretically on two dissimilar piezoelectric media with an interfacial crack at the edge of a circular cavity subjected to time-harmonic incident anti-plane shearing in present paper. The formulations are based on the methods of Green’s function and conjunction. Dynamic stress intensity factor at the crack’s tip are obtained by solving boundary value problems with the methods of conjunction and crack-division technique. The calculating results are plotted so as to show how the frequencies of incident wave, all kinds of physical parameters of two dissimilar piezoelectric materials, applied electric loads and geometric parameters influence on the dynamic stress intensity factor (DSIF). While some of the calculating results are compared with other published documents.

Copyright © 2010 by ASME

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