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Submerged Jet Impingement Cooling of a Nanostructured Plate

[+] Author Affiliations
Muhsincan Sesen, Ali Kosar, Ebru Demir, Evrim Kurtoglu, Nazli Kaplan, Hadi Cagdas Erk

Sabanci University, Istanbul, Turkey

Wisam Khudhayer, Tansel Karabacak

University of Arkansas at Little Rock, Little Rock, AR

Paper No. IMECE2010-39055, pp. 1553-1558; 6 pages
  • ASME 2010 International Mechanical Engineering Congress and Exposition
  • Volume 7: Fluid Flow, Heat Transfer and Thermal Systems, Parts A and B
  • Vancouver, British Columbia, Canada, November 12–18, 2010
  • Conference Sponsors: ASME
  • ISBN: 978-0-7918-4444-1
  • Copyright © 2010 by ASME


In this paper, the results of a series of heat transfer experiments conducted on a compact electronics cooling device based on single phase jet impingement techniques are reported. Deionized-water is propelled into four microchannels of inner diameter 685 μm which are used as nozzles and located at a nozzle to surface distance of 2.5mm. The generated jet impingement is targeted through these channels towards the surface of a nanostructured plate. This plate of size 20mmx20mm consisted of ∼600 nm long copper nanorod arrays with an average nanorod diameter of ∼150 nm, which were integrated on top of a silicon wafer substrate coated with a copper thin film layer (i.e. Cu-nanorod/Cu-film/Silicon-wafer). Heat removal characteristics induced through jet impingement are investigated using the nanostructured plate and compared to results obtained from a flat plate of copper thin film coated on silicon wafer surface. Enhancement in heat transfer up to 15% using the nanostructured plate has been reported in this paper. Heat generated by small scale electronic devices is simulated using a thin film heater placed on an aluminum base. Surface temperatures are recorded by a data acquisition system with the thermocouples integrated on the surface at various locations. Constant heat flux provided by the film heater is delivered to the nanostructured plate placed on top of the base. Volumetric flow rate and heat flux values were varied in order to better characterize the potential enhancement in heat transfer by nanostructured surfaces.

Copyright © 2010 by ASME



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