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Tape Peel Testing as a Simple Method to Evaluate Interfacial Adhesion of Sputtered Thin Layers of Various Metals

[+] Author Affiliations
Bernd Scholz, Ismir Pekmic, Syed S. Ahmad, Aaron Reinholz

North Dakota State University (NDSU), Fargo, ND

Paper No. IMECE2010-40854, pp. 533-539; 7 pages
  • ASME 2010 International Mechanical Engineering Congress and Exposition
  • Volume 4: Electronics and Photonics
  • Vancouver, British Columbia, Canada, November 12–18, 2010
  • Conference Sponsors: ASME
  • ISBN: 978-0-7918-4428-1
  • Copyright © 2010 by ASME


The quality and reliability of electronic systems depend on the integrity of interfacial adhesion. Adhesion is critical at all electronics assembly levels. Material layers on a chip, package and system need to have excellent adhesion to each other. Thin films are an integral part of chip devices and also are necessary at other levels of electronic systems. The quality and reliability of their interfacial adhesion defines the quality and reliability of the finished product. To assure interfacial adhesion integrity, numerous measurement techniques are employed. Most of these measurement techniques require the use of sophisticated and expensive equipment. Of the simpler techniques, one is tape peel testing which usually is used as a go no-go screening test. This paper outlines its application as a valid quantifiable evaluation tool. In this narrative, testing setup and measurement procedure is outlined for tape peel testing. The procedure was used successfully to evaluate and choose pretreatments to enhance interfacial adhesion of sputtered thin layers of various metals. It is shown that the procedure provided results which could be validated through subsequent thick film peel testing. Thin films are used industry-wide in applications other than electronic systems, therefore, this study is applicable industry-wide providing a quantifiable method to measure thin film adhesion.

Copyright © 2010 by ASME
Topics: Metals , Testing



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