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Organic Monolayers for Low Temperature Copper – Gold Bonding

[+] Author Affiliations
X. F. Ang, H. J. Lu, J. Wei

Singapore Institute of Manufacturing Technology, Singapore

H. J. Zhang, C. C. Wong

Nanyang Technological University, Singapore

Paper No. IMECE2010-38552, pp. 281-284; 4 pages
doi:10.1115/IMECE2010-38552
From:
  • ASME 2010 International Mechanical Engineering Congress and Exposition
  • Volume 4: Electronics and Photonics
  • Vancouver, British Columbia, Canada, November 12–18, 2010
  • Conference Sponsors: ASME
  • ISBN: 978-0-7918-4428-1
  • Copyright © 2010 by ASME

abstract

In this study low temperature copper-gold bonding in ambient is demonstrated successfully with the help of organic monolayers. Further investigation is made to evaluate the influence of chain length of these monolayers to alleviate bonding temperature. We found that a single coat of organic monolayer on copper showed superior bond strength as compared to a double-coating on both copper and gold surfaces respectively. Despite effective surface passivation against oxide formation (Cu) and organic contaminant from ambient (Au) by long chain organic monolayers, when both surfaces are coated with the longest monolayer, weaker bond strength was observed. The results suggest that the ease of removal of organic monolayers from Cu and Au surface respectively prior to bonding plays a dominant role in enabling low temperature Cu-Au bonding.

Copyright © 2010 by ASME

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