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Copper to Copper Direct Bonding Assisted by Self-Assembled Monolayer

[+] Author Affiliations
D. F. Lim, C. S. Tan

Nanyang Technological University, Singapore

X. F. Ang, J. Wei

Singapore Institute of Manufacturing Technology, Singapore

C. M. Ng

Global Foundries Pte Ltd., Singapore

Paper No. IMECE2010-38565, pp. 79-82; 4 pages
doi:10.1115/IMECE2010-38565
From:
  • ASME 2010 International Mechanical Engineering Congress and Exposition
  • Volume 4: Electronics and Photonics
  • Vancouver, British Columbia, Canada, November 12–18, 2010
  • Conference Sponsors: ASME
  • ISBN: 978-0-7918-4428-1
  • Copyright © 2010 by ASME

abstract

In this article, a self-assembled monolayer (SAM) is applied onto the copper surface in an attempt to lower the required bonding temperature. Alkane-thiol with 6-carbon chain length is used and tested for bonding experiment. The adsorption of SAM is confirmed by the sharp rise of the water contact angle measurement and the reduced in the surface roughness. Next, the desorption of SAM is done at a high temperature anneal (<300°C) in an inert ambient and its properties are characterized by the water contact angle measurement and XPS. It is found that the water contact angle measurement decreases sharply close back to the contact angle of the pure blanket copper surface after annealing of SAM. The XPS results also show the ability of SAM in protecting Copper surface from oxidation. Finally, shear test is performed on Cu-Cu structures bonded at low temperature (250°C) in order to verify the SAM behavior in protecting the copper surface from oxidation and enhancement for bonding. The wafer pairs with and without SAM are intentionally exposed in clean room environment for few days. The bonded pieces are diced and subject to shear stress and results show that with SAM protection, shear strength is improved due to the enhancement in grain growth as a result of cleaner surface.

Copyright © 2010 by ASME

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