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Solid-Liquid Interface Slip as a Rate Process

[+] Author Affiliations
A. Martini, S. Lichter, R. Q. Snurr, Q. Wang

Northwestern University, Evanston, IL

Paper No. IJTC2007-44022, pp. 773-774; 2 pages
doi:10.1115/IJTC2007-44022
From:
  • ASME/STLE 2007 International Joint Tribology Conference
  • ASME/STLE 2007 International Joint Tribology Conference, Parts A and B
  • San Diego, California, USA, October 22–24, 2007
  • Conference Sponsors: Tribology Division
  • ISBN: 0-7918-4810-8 | eISBN: 0-7918-3811-0
  • Copyright © 2007 by ASME

abstract

Thin film lubrication may be significantly affected by slip at the solid-liquid interface. Slip occurs when there is a jump in the mean speed between the walls and the first layer of liquid molecules. Using molecular simulation, we show that the amount of slip is greatly affected by solvation pressure and that this dependence can be accounted for by treating slip as a rate process. This treatment enables formulation of a quantitative relationship between solvation pressure and interface slip.

Copyright © 2007 by ASME

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