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A Thermal Network Approach for Predicting Thermal Characteristics of Three-Dimensional Electronic Packages

[+] Author Affiliations
P. L. Chen, S. F. Chang, T. Y. Wu, Y. H. Hung

National Tsing Hua University

Paper No. IMECE2006-13755, pp. 113-120; 8 pages
doi:10.1115/IMECE2006-13755
From:
  • ASME 2006 International Mechanical Engineering Congress and Exposition
  • Heat Transfer, Volume 3
  • Chicago, Illinois, USA, November 5 – 10, 2006
  • Conference Sponsors: Heat Transfer Division
  • ISBN: 0-7918-4786-1 | eISBN: 0-7918-3790-4
  • Copyright © 2006 by ASME

abstract

In the present study, a numerical approach for characterizing three-dimensional (3-D) electronic packages is presented, based on the steady-state solution of the thermal network method for generalized rectangular geometries, where boundary conditions are uniformly specified over specific regions of the package. As we know, the thermal-network method is very powerful on thermal analysis of electronic packaging because of its feasibility and flexibility. Accordingly, the numerical approach with thermal-network method to simulate heat transfer characteristics for 3-D package geometries becomes important in the modem microelectronic applications. The thermal analyses are presented with a general overview of the thermal network method, boundary conditions and solution procedures. Furthermore, the application of boundary conditions at the fluid-solid, package-board and layer-layer interfaces provides a means for obtaining a unique numerical result for 3-D complex electronic packages. The complex geometries found in most 3-D electronic package configurations are modeled using numerical method through the careful use of simplifying assumptions. Comparisons of the present numerical results with the existing experimental data for 3-D electronic package of pin grid arrays and multi-chip modules are made with a satisfactory agreement. Thus, the present study demonstrates that the numerical thermal-network approach can offer an accurate and efficient solution procedure for evaluating the thermal characterization of 3-D electronic packages.

Copyright © 2006 by ASME

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