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Microfabrication and Packaging Issues in the Development of a Planar Silicon Loop Heat Pipe, Using Si02 Fiber Wicks

[+] Author Affiliations
Praveen S. Medis

University Of Cincinnati

Srinivas Parimi, Ahmed Shuja, H. Thurman Henderson, Junwoo Suh, Frank M. Gerner

University of Cincinnati

Paper No. IMECE2006-13543, pp. 67-76; 10 pages
doi:10.1115/IMECE2006-13543
From:
  • ASME 2006 International Mechanical Engineering Congress and Exposition
  • Heat Transfer, Volume 3
  • Chicago, Illinois, USA, November 5 – 10, 2006
  • Conference Sponsors: Heat Transfer Division
  • ISBN: 0-7918-4786-1 | eISBN: 0-7918-3790-4
  • Copyright © 2006 by ASME

abstract

The focus of this work is the physical development and performance of an infinitely expandable planar non-standard MEMS loop heat pipe, targeted for electronic cooling. The composition is principally semiconductor grade silicon, with some glass components, requiring neither internal pumps nor external power, except the waste heat which causes its operation. In as much as modern microelectronics is of a planar configuration, the cooling device surfaces (unlike the classical cylindrical heat pipe) should ideally also be planar. Here the authors report such a compatible planar heat pipe, infinitely expandable in surface area, using inexpensive batch processing and glass (silicon dioxide) fiber as the wick. Preliminary results have demonstrated 42 and 65 W/Cm2 in closed and open loop configurations, respectively. These power dissipating levels greatly exceed that required for most emerging CPU's and other electronics.

Copyright © 2006 by ASME

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