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Flow Boiling in a Silicon Microchannel Array

[+] Author Affiliations
Poh-Seng Lee, Suresh V. Garimella

Purdue University

Paper No. IMECE2006-14577, pp. 309-315; 7 pages
doi:10.1115/IMECE2006-14577
From:
  • ASME 2006 International Mechanical Engineering Congress and Exposition
  • Heat Transfer, Volume 2
  • Chicago, Illinois, USA, November 5 – 10, 2006
  • Conference Sponsors: Heat Transfer Division
  • ISBN: 0-7918-4785-3 | eISBN: 0-7918-3790-4
  • Copyright © 2006 by ASME

abstract

Flow boiling in arrays of parallel silicon microchannels is investigated using a test piece with distributed heat sources and integrated local temperature sensors. The microchannels considered are 400 μm wide and 398 μm deep. Each test chip has a footprint of 1.27 cm by 1.27 cm with parallel microchannels diced onto the back side. Twenty-five microsensor arrays integrated into the microchannel heat sinks allow for accurate local temperature measurements over the entire chip. The experiments were conducted with deionized water which enters the channels in a subcooled state. Results are presented in terms of temperatures and pressure drops as a function of imposed heat flux. The experimental results aid in the assessment of the applicability of existing models and correlations in predicting the heat transfer rates in microchannels.

Copyright © 2006 by ASME

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