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Heat Transfer Enhancement of Planar Pulsating Heat Pipe Device

[+] Author Affiliations
Qingjun Cai, Chung-Lung Chen

Rockwell Scientific Company

Julie F. Asfia

The Boeing Company

Paper No. IMECE2006-13737, pp. 153-158; 6 pages
doi:10.1115/IMECE2006-13737
From:
  • ASME 2006 International Mechanical Engineering Congress and Exposition
  • Heat Transfer, Volume 2
  • Chicago, Illinois, USA, November 5 – 10, 2006
  • Conference Sponsors: Heat Transfer Division
  • ISBN: 0-7918-4785-3 | eISBN: 0-7918-3790-4
  • Copyright © 2006 by ASME

abstract

Heat pipes are widely used heat transfer devices in the electronic cooling area. In this paper, a novel pulsating heat pipe (PHP) design, which combines features of PHP and capillary microstructures, is presented to enhance heat transfer of electronic printed circuit boards (PCB). Test prototype fabrication is initiated by making dual-radius serpentine channels on a 4.0mm thick aluminum plate, followed by compressing 4.67mm diameter copper tube into the grooves, and completed by generating a millimeter sized liquid channel with micro-grooves in the PHP along the longitudinal direction. Because of this design, the planar PHP is able to circulate operating liquid by both capillary pump and oscillation motions, which eliminate the dry state in the evaporator section and supply sufficient coolant at high heat loads. Demonstrations of heat transfer performance indicate that the planar PHP has high effective thermal conductivity and low evaporator temperature fluctuations, and oscillation continuity is the key factor to reduce the temperature difference between the evaporator and condenser.

Copyright © 2006 by ASME

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