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Dependence of Thermal Boundary Conductance on Interfacial Mixing at the Chromium-Silicon Interface

[+] Author Affiliations
Patrick E. Hopkins, Richard N. Salaway, Pamela M. Norris

University of Virginia

Robert J. Stevens

Rochester Institute of Technology

Paper No. IMECE2006-15288, pp. 215-224; 10 pages
  • ASME 2006 International Mechanical Engineering Congress and Exposition
  • Heat Transfer, Volume 1
  • Chicago, Illinois, USA, November 5 – 10, 2006
  • Conference Sponsors: Heat Transfer Division
  • ISBN: 0-7918-4784-5 | eISBN: 0-7918-3790-4
  • Copyright © 2006 by ASME


The thermal conductance at solid-solid interfaces is becoming increasingly important in thermal considerations dealing with devices on nanometer length scales. Specifically, interdiffusion or mixing around the interface, which is generally ignored, must be taken into account when the characteristic lengths of the devices are on the order of the thickness of this mixing region. To study the effect of this interfacial mixing on thermal conductance, a series of Cr films are grown on Si substrates subject to various deposition conditions to control the growth around the Cr/Si boundary. The Cr/Si interfaces are characterized with auger electron spectroscopy depth profiling. The thermal boundary conductance (hBD ) is measured with the transient thermoreflectance technique. Values of hBD are found to vary with both the thickness of the mixing region and the rate of compositional change in the mixing region. The effects of the varying mixing regions in each sample on hBD are discussed and the results are compared to the diffuse mismatch model.

Copyright © 2006 by ASME



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