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Recent Advances in Thermal Modeling of Micro-Evaporators for Cooling of Microprocessors

[+] Author Affiliations
John R. Thome, Bruno Agostini, Jung Eung Park

Ecole Polytechnique Fédérale de Lausanne, Lausanne, Switzerland

Rémi Revellin

Centre de Thermique de Lyon, CETHIL, Villeurbanne Cedex, France

Paper No. IMECE2007-42900, pp. 1583-1592; 10 pages
doi:10.1115/IMECE2007-42900
From:
  • ASME 2007 International Mechanical Engineering Congress and Exposition
  • Volume 8: Heat Transfer, Fluid Flows, and Thermal Systems, Parts A and B
  • Seattle, Washington, USA, November 11–15, 2007
  • Conference Sponsors: ASME
  • ISBN: 0-7918-4302-5 | eISBN: 0-7918-3812-9
  • Copyright © 2007 by ASME

abstract

Cooling of microprocessors using flow boiling of low pressure refrigerants in multi-microchannel evaporator cooling elements is a promising technique for dissipation of footprint heat fluxes of over 300 W/cm2 while maintaining the chip safely below its maximum working temperature, providing a nearly uniform chip base temperature and minimizing energy consumption. The present invited lecture focuses on our recent experimental work and modeling of two-phase flow and boiling in single and multi-microchannels, covering: bubble dynamics, bubble coalescence, flow pattern recognition, diabatic flow pattern map, critical heat flux, hot spots, flow boiling heat transfer and two-phase pressure drops.

Copyright © 2007 by ASME
Topics: Cooling , Modeling

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