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Qualification of SiP Products: Quasi-Static Cyclic Mechanical Bending

[+] Author Affiliations
D. Farley, Y. Zhou, A. Dasgupta

University of Maryland, College Park, MD

J. F. J. Caers, J. W. C. de Vries

Philips Applied Technologies

Paper No. IMECE2007-43898, pp. 451-458; 8 pages
  • ASME 2007 International Mechanical Engineering Congress and Exposition
  • Volume 5: Electronics and Photonics
  • Seattle, Washington, USA, November 11–15, 2007
  • Conference Sponsors: ASME
  • ISBN: 0-7918-4299-1 | eISBN: 0-7918-3812-9
  • Copyright © 2007 by ASME


An LGA (Land Grid Array) laminate-based epoxy-molded RF SiP (system-in-package) containing four wirebonded and three flip-chip dice is qualified for quasi-static mechanical flexure using a PoF (Physics-of-Failure) approach. The process includes: design and execution of accelerated stress testing; failure analysis to identify the failure mode and mechanism; and mechanistic simulations to assess acceleration factors for extrapolation of the failures to field environments for selected failure mechanisms. Illustrative qualification results are presented for solder joint fatigue.

Copyright © 2007 by ASME



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