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Characterizations of Ball Impact Responses of Tin-Silver-Copper Solder Joints Doped With Nickel or Germanium

[+] Author Affiliations
Yi-Shao Lai, Hsiao-Chuan Chang, Ying-Ta Chiu

Advanced Semiconductor Engineering, Inc., Kaohsiung, Taiwan

Jenn-Ming Song

National Dong Hwa University, Hualien, Taiwan

Paper No. IMECE2007-41232, pp. 305-311; 7 pages
  • ASME 2007 International Mechanical Engineering Congress and Exposition
  • Volume 5: Electronics and Photonics
  • Seattle, Washington, USA, November 11–15, 2007
  • Conference Sponsors: ASME
  • ISBN: 0-7918-4299-1 | eISBN: 0-7918-3812-9
  • Copyright © 2007 by ASME


The ball impact test (BIT) was developed based on the demand of a package-level measure of the board-level reliability of solder joints in the sense that it leads to brittle intermetallic fracturing, similar to that from a board-level drop test. The BIT itself stands alone as a unique and novel test methodology in characterizing strengths of solder joints under a high-speed shearing load. In this work, we present BIT results conducted at an impact velocity of 500 mm/s on Sn-4Ag-0.5Cu, Sn-1Ag-0.5Cu, Sn-1Ag-0.5Cu-0.05Ni, Sn-1.2Ag-0.5Cu-0.05Ni, and Sn-1Ag-0.5Cu-0.05Ge package-level solder joints, bonded on substrate pads of immersion tin (IT) and direct solder on pad (DSOP) surface finishes. Differences of BIT results with respect to multi-reflow are also reported.

Copyright © 2007 by ASME



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