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Opto Mechanical Package Development

[+] Author Affiliations
Graham Kryger, Anika McCarter

Washington State University at Vancouver, Vancouver, WA

Paper No. IMECE2007-43600, pp. 23-28; 6 pages
doi:10.1115/IMECE2007-43600
From:
  • ASME 2007 International Mechanical Engineering Congress and Exposition
  • Volume 5: Electronics and Photonics
  • Seattle, Washington, USA, November 11–15, 2007
  • Conference Sponsors: ASME
  • ISBN: 0-7918-4299-1 | eISBN: 0-7918-3812-9
  • Copyright © 2007 by ASME

abstract

The focus of this student project was to design and develop a laser diode opto-mechanical package for nLight Photonics Company. This design process involved examining the existing models of the package design and assessing the manufacturing process. Limitations regarding tooling, alignment, and package materials were also taken into account. The package was modeled in SolidWorks, considering these limiting parameters and changing the size and shape of the package from previous models in order to increase spatial efficiency. Analysis of the package was performed to ensure heat would dissipate properly from the diode, and that the diode would operate within the specified temperature range. The thermal analysis was performed using various methods, including a simple spreadsheet analysis and specialized software. This paper will examine each of these design processes in more detail.

Copyright © 2007 by ASME

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