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Laser Heating and Thermally Enhanced Deformation of Silicon

[+] Author Affiliations
Lei Dong

University of North Carolina - Charlotte, Charlotte, NC

John A. Patten

Western Michigan University, Kalamazoo, MI

Paper No. MSEC2007-31014, pp. 305-309; 5 pages
  • ASME 2007 International Manufacturing Science and Engineering Conference
  • ASME 2007 International Manufacturing Science and Engineering Conference
  • Atlanta, Georgia, USA, October 15–18, 2007
  • Conference Sponsors: Manufacturing Division
  • ISBN: 0-7918-4290-8 | eISBN: 0-7918-3809-9
  • Copyright © 2007 by ASME


A novel hybrid system, using a fiber coupled infrared (IR) laser and through the tool delivery of the beam energy, has been developed for micro laser assisted machining (μ-LAM) of semiconductors and ceramics. This system uses diamond tooling and the laser energy is delivered to the work piece though the cutting tool. The diamond cutting tool and IR fiber laser are directly coupled and integrated into a single package. Of particular significance is that the combination of parameters, i.e. laser wavelength selected for specific materials (such as silicon and silicon carbide), permits heating and thermally softening the chip formation zone, while leaving the balance of the work piece unaffected (thermally). The system is being developed for nano-micro level machining processes, such as practiced with ductile regime machining of semiconductors and ceramics in the field of precision engineering.

Copyright © 2007 by ASME



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