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Reliability of Power Electronic Modules

[+] Author Affiliations
H. Lu, T. Tilford, C. Bailey

University of Greenwich, London, UK

W. S. Loh

University of Sheffield, Sheffield, Yorkshire, UK

M. Johnson

University of Nottingham, Nottingham, UK

Paper No. IPACK2007-33817, pp. 883-888; 6 pages
doi:10.1115/IPACK2007-33817
From:
  • ASME 2007 InterPACK Conference collocated with the ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference
  • ASME 2007 InterPACK Conference, Volume 2
  • Vancouver, British Columbia, Canada, July 8–12, 2007
  • Conference Sponsors: Electronic and Photonic Packaging Division
  • ISBN: 0-7918-4278-9 | eISBN: 0-7918-3801-3
  • Copyright © 2007 by ASME

abstract

The electric car, the all electric aircraft and requirements for renewable energy are examples of potential technologies needed to address the world problem of global warming/carbon emission etc. Power electronics and packaged modules are fundamental for the underpinning of these technologies and with the diverse requirements for electrical configurations and the range of environmental conditions, time to market is paramount for module manufacturers and systems designers alike. This paper details some of the results from a major UK project into the reliability of power electronic modules using physics of failure techniques. This paper presents a design methodology together with results that demonstrate enhanced product design with improved reliability, performance and value within acceptable time scales.

Copyright © 2007 by ASME
Topics: Reliability

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