Full Content is available to subscribers

Subscribe/Learn More  >

Reliability Analysis of Solderless Press-Fit Interconnections

[+] Author Affiliations
Hironori Tohmyoh, Kiichiro Yamanobe, Masumi Saka, Yoshikatsu Nakano

Tohoku University, Sendai, Miyagi, Japan

Jiro Utsunomiya, Takeshi Nakamura

Keihin Corporation, Shioya, Tochigi, Japan

Paper No. IPACK2007-33264, pp. 611-615; 5 pages
  • ASME 2007 InterPACK Conference collocated with the ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference
  • ASME 2007 InterPACK Conference, Volume 2
  • Vancouver, British Columbia, Canada, July 8–12, 2007
  • Conference Sponsors: Electronic and Photonic Packaging Division
  • ISBN: 0-7918-4278-9 | eISBN: 0-7918-3801-3
  • Copyright © 2007 by ASME


This paper treats typical mechanical problems met in a solderless press-fit assembly. First, the elastic-plastic properties of a pin and the friction coefficient of the pin in thin plated through hole (TH) are determined by the experiments and the three-dimensional finite element (FE) analysis. The elastic-plastic properties of the press-fit pin are determined by the small scale three-point bending. The friction coefficient of the pin in the TH is successfully determined from the load-displacement relationship of the pin during press-fit assembly. The validity of the determined parameters is to be clarified by conducting the press-fit assemblies into the holes with different diameters. By comparing the damaged area of the printed circuit boards after assembly and the stress distributions obtained numerically, the failure stress of the board is determined. Finally, both the retention force of the pin and the damage of the printed circuit board after assembly become possible to be predicted by the numerical analysis.

Copyright © 2007 by ASME



Interactive Graphics


Country-Specific Mortality and Growth Failure in Infancy and Yound Children and Association With Material Stature

Use interactive graphics and maps to view and sort country-specific infant and early dhildhood mortality and growth failure data and their association with maternal

Citing articles are presented as examples only. In non-demo SCM6 implementation, integration with CrossRef’s "Cited By" API will populate this tab (http://www.crossref.org/citedby.html).

Some tools below are only available to our subscribers or users with an online account.

Related Content

Customize your page view by dragging and repositioning the boxes below.

Related eBook Content
Topic Collections

Sorry! You do not have access to this content. For assistance or to subscribe, please contact us:

  • TELEPHONE: 1-800-843-2763 (Toll-free in the USA)
  • EMAIL: asmedigitalcollection@asme.org
Sign In