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Effect of La Doping on SnAg Solder Microstructure Evolution

[+] Author Affiliations
Min Pei, Jianmin Qu

Georgia Institute of Technology, Atlanta, GA

Paper No. IPACK2007-33701, pp. 407-413; 7 pages
doi:10.1115/IPACK2007-33701
From:
  • ASME 2007 InterPACK Conference collocated with the ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference
  • ASME 2007 InterPACK Conference, Volume 2
  • Vancouver, British Columbia, Canada, July 8–12, 2007
  • Conference Sponsors: Electronic and Photonic Packaging Division
  • ISBN: 0-7918-4278-9 | eISBN: 0-7918-3801-3
  • Copyright © 2007 by ASME

abstract

In this paper, quantitative microstructure studies were performed on multiple length scales to investigate effect of La doping on SnAg lead free solder materials. Variables considered in this paper include doping amount, aging temperature and aging time. It was found that La doping refines the microstructure and reduces microstructure coarsening rate, but the inter-particle spacing remains unaffected. Therefore, higher La doping level leads to higher volume fraction of the eutectic phase due to the increased total number of Ag3 Sn particles.

Copyright © 2007 by ASME

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