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Evaluation of Time-Independent and Time-Dependent Strains of Lead-Free Solder by Stepped Ramp Loading Test

[+] Author Affiliations
Ken-Ichi Ohguchi, Setsuo Aso

Akita University, Akita, Akita, Japan

Katsuhiko Sasaki

Hokkaido University, Sapporo, Hokkaido, Japan

Paper No. IPACK2007-33663, pp. 107-113; 7 pages
  • ASME 2007 InterPACK Conference collocated with the ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference
  • ASME 2007 InterPACK Conference, Volume 2
  • Vancouver, British Columbia, Canada, July 8–12, 2007
  • Conference Sponsors: Electronic and Photonic Packaging Division
  • ISBN: 0-7918-4278-9 | eISBN: 0-7918-3801-3
  • Copyright © 2007 by ASME


This paper proposes a method which can estimate essential material constants of an elasto-plastic-creep constitutive model for lead-free solders by conducting only a tensile test. The test employs a stepped ramp wave loading which repeats instantaneous straining and strain maintaining. The time-independent strains can be evaluated by using the stress-strain relations at the instantaneous straining parts, while the time-dependent strain can be evaluated by using the stress-time relations during the strain maintaining parts. Based on the results of the evaluations, the material constants of the elasto-plastic-creep models are estimated. Simulations of the viscoplastic deformations of Sn-3.0Ag-0.5Cu solder alloy were also conducted to verify the validity of the proposed method.

Copyright © 2007 by ASME



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