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Investigation of Drill Hole Quality of Multi-Layer PWBs for High Current Capacity

[+] Author Affiliations
Eiichi Aoyama, Toshiki Hirogaki, Kenichi Mori, Yuusuke Itagaki

Doshisha University, Kyotanabe, Kyoto, Japan

Keiji Ogawa

University of Shiga Prefecture, Hikone, Shiga, Japan

Paper No. IPACK2007-33255, pp. 909-915; 7 pages
doi:10.1115/IPACK2007-33255
From:
  • ASME 2007 InterPACK Conference collocated with the ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference
  • ASME 2007 InterPACK Conference, Volume 1
  • Vancouver, British Columbia, Canada, July 8–12, 2007
  • Conference Sponsors: Electronic and Photonic Packaging Division
  • ISBN: 0-7918-4277-0 | eISBN: 0-7918-3801-3
  • Copyright © 2007 by ASME

abstract

Recently, as a result of changes in the automotive industry, a large number of electronic systems have been installed in cars. The thickness of the copper foil used for printed wiring boards (PWBs) has tended to increase in response to the large current capacity required for such electronic equipment. Therefore, the nail head generated in the inner layer copper foil was examined with respect to the influence of the thickness of the copper foil on the through-hole quality. In the present study, the size of the nail head generated in the copper foil after drilling a through hole was used as the objective variable. The explaining variables included drill wear, frequency, feed rate, chip load, drill temperature, copper foil thickness, copper foil cutting distance, and number of drill holes. We investigated the relationships between these explaining variables and the objective variable and found that the copper foil cutting distance was a very important parameter in generating nail heads. In addition, we found that the chip load is important for controlling nail head generation.

Copyright © 2007 by ASME

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