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Loop Thermosyphon Design for Cooling of Large Area, High Heat Flux Sources

[+] Author Affiliations
John R. Hartenstine, Richard W. Bonner, III, Jared R. Montgomery

Advanced Cooling Technologies, Inc., Lancaster, PA

Tadej Semenic

University of California - Los Angeles, Los Angeles, CA

Paper No. IPACK2007-33993, pp. 715-722; 8 pages
doi:10.1115/IPACK2007-33993
From:
  • ASME 2007 InterPACK Conference collocated with the ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference
  • ASME 2007 InterPACK Conference, Volume 1
  • Vancouver, British Columbia, Canada, July 8–12, 2007
  • Conference Sponsors: Electronic and Photonic Packaging Division
  • ISBN: 0-7918-4277-0 | eISBN: 0-7918-3801-3
  • Copyright © 2007 by ASME

abstract

Two-phase flow loop technologies capable of acquiring high heat fluxes (>1kW/cm2 ) from large area heat sources (10cm2 ) are being considered for the next generation naval thermal requirements. A loop thermosyphon device (∼1 meter tall) was fabricated and tested that included several copper porous wick structures in cylindrical evaporators. The first two were standard annular monoporous and biporous wick designs. The third wick consists of an annular evaporator wick and an integral secondary slab wick for improved liquid transport. In this configuration a circular array of cylindrical vapor vents are formed integral to the primary and secondary transport wick composite. Critical heat fluxes using these wick structures were measured between 240W/cm2 and 465W/cm2 over a 10cm2 area with water as the working fluid at 70°C saturation temperature. A thermosyphon model capable of predicting flow rate at various operating conditions based on a separated flow model is presented.

Copyright © 2007 by ASME

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