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A Study on Polymer Pin Fin Based Heat Sinks

[+] Author Affiliations
Ajmal Ansari

Visteon Corporation, Van Buren Township, MI

Paper No. IPACK2007-33968, pp. 637-642; 6 pages
doi:10.1115/IPACK2007-33968
From:
  • ASME 2007 InterPACK Conference collocated with the ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference
  • ASME 2007 InterPACK Conference, Volume 1
  • Vancouver, British Columbia, Canada, July 8–12, 2007
  • Conference Sponsors: Electronic and Photonic Packaging Division
  • ISBN: 0-7918-4277-0 | eISBN: 0-7918-3801-3
  • Copyright © 2007 by ASME

abstract

Recent developments in polymer additives and formulations have made available resins that have thermal conductivity that is one to two orders of magnitude higher than that of typical engineering polymers. Such polymers can be potentially used for designing heat sinks. There are two primary advantages of polymer heat sinks: ability to form shapes that may not be feasible with metal and flexibility that allows the heat sink to be bent in various shapes. This paper presents results from a study that was conducted to determine the suitability of commercially available Flexible Heat Sink Material for use in cooling high power LED’s.

Copyright © 2007 by ASME
Topics: Polymers , Heat sinks

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