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Generating Behavior of Whisker on Pb Free Sn Plating and Its Control

[+] Author Affiliations
Yuki Takeshita, Yuji Kimura

Kogakuin University, Tokyo, Japan

Paper No. IPACK2007-33902, pp. 591-594; 4 pages
doi:10.1115/IPACK2007-33902
From:
  • ASME 2007 InterPACK Conference collocated with the ASME/JSME 2007 Thermal Engineering Heat Transfer Summer Conference
  • ASME 2007 InterPACK Conference, Volume 1
  • Vancouver, British Columbia, Canada, July 8–12, 2007
  • Conference Sponsors: Electronic and Photonic Packaging Division
  • ISBN: 0-7918-4277-0 | eISBN: 0-7918-3801-3
  • Copyright © 2007 by ASME

abstract

The Sn-Pb alloy plating is mainly used for an electronic material now. However, there is a problem that Pb pollutes the environment. Therefore, Sn-Pb alloys are principally prohibited using in the electronic component with the RoHS instruction. Therefore, an alternative material of Pb is called upon now. However, whisker generation have been problem when an alternative material of Sn-Pb alloy is used. Therefore in this study, various investigations are conducted to prevent whisker generation when an alternative material of Pb is used on the basis of microstructure control for best plating material.

Copyright © 2007 by ASME
Topics: Plating

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